Verified recordCommercial · STMicroelectronicsUpdated 2026-09-28
ISM330DHCXTR
A system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications, part of ST's iNEMO inertial module family with Machine Learning Core and Finite State Machine. Tape & Reel packaging.
Part number dissection
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ISM330DHCXA system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications, part of ST's iNEMO inertial module family with Machine Learning Core and Finite State Machine.
TRTape & Reel packaging.
Specifications
Base codeA system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications, part of ST's iNEMO inertial module family with Machine Learning Core and Finite State Machine.
Finish / variantTape & Reel packaging.
Acceptable alternates
ISM330DHCXSame core sensor and parameters; 'TR' suffix denotes Tape and Reel packaging, while this variant is typically tray packed.
ISM330DLCTRHighly possible drop-in replacement with identical VFLGA2.5X3X.86 package, serving as a strategic cross-reference.
ISM330ISTRMechanically compatible with the exact same physical footprint (VFLGA2.5X3X.86) and can fit on the same PCB pads.
Confirm acceptability against your drawing before ordering.
Availability
SupplyVerified supply chain on file
Lead timeQuoted on request
TraceabilityFull documentation with every shipment
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BTEK Components MFG LLC · Largo, FloridaPart data compiled and verified by BTEK's sourcing engine.